SEMI
Search

  

 

Resources for Members: Event Highlights

Welcome to a premium content section which provides additional valuable resources for SEMI Members. The information on this page is from past events and presentations. This Members Only area includes information on Semiconductor Equipment, Materials, Public Policy, Nanotechnology and MEMS. Also included are selected presentations from SEMI executive level conferences (ISS, SMC, and SBC).

 
  

To view these PDF files you will need the latest version of Adobe Acrobat Reader. Get Adobe Acrobat now!

  
  
Strategic Business Conference
 
Member Only Content Presentation from Nanochip
(11.4MB SWF) April 2008
Gordon Knight, CEO Nanochip Inc.
 
Member Only Content A Collaboration Model to Enable the Age of Material Innovation in Semiconductors
(60MB WMV) April 2008
Paul A. Farrar, JR; Vice President, Process Development, IBM Semiconductor Research and Development Center
 
Member Only Content Chip and Package Integration: New Opportunities for Eqpmt and Mtrls Suppliers
(278KB PDF) May 2007, David Hays -- VP Wafer Level Packaging, Amkor Technology
 

 
Best of ISS US
 
Member Only Content Semiconductor Trends: The Era of Profitless Prosperity (16MB FLASH)
January 2008
Steve Newberry, Chairman & CEO LAM
 
Member Only Content The Techonomics of Design and Manufacturing (6MB PDF)
January 2008
Aart J. de Geus, Chairman & CEO Synopsys, Inc.
 
Member Only Content The Impact of the New IC Industry Cycle Dynamics (3MB PDF)
January 2008
Bill McClean, President, IC Insights
 
Member Only Content The Semiconductor Future Perspectives and Projections (226KB PDF)
January 2008
Dale Ford, Vice President, Market Intelligence
 
Member Only Content Taking it to the Street: What’s Hot, What’s Not (74KB PDF)
January 2008
Brett Hodess, Equity Research Analyst, Merrill Lynch
 
Member Only Content Shifting Winds of Power (467KB PDF)
January 2008
Dan Hutcheson, CEO, VLSI Research Inc.
 
Member Only Content U.S. Public Policy Update (181KB PDF)
January 2008
Dave Miller, Group Vice President, DuPont Electronic and Communication Technologies; Chairman, SEMI NAAB Public Policy Committee
 
Member Only Content An Industry at Crossroads (322KB PDF)
January 2008
Dean W. Freeman, Gartner
 
Member Only Content Shareholder Returns: (3MB PDF)
January 2008
Dr. Douglas Grose, Senior Vice President, Manufacturing, Process Technology Development and Supply Chain
 
Member Only Content Industry Revenue Growth: SIA Forecast (84KB PDF)
January 2008
George Scalise, President, Semiconductor Industry Association
 
Member Only Content The Global Engineer Labor Market (502KB PDF)
January 2008
Greg Linden and Clair Brown, University of California, Berkeley
 

 
Best of ISS Europe
 
Member Only Content Research Challenges for CMOS Scaling: Industry Directions (2.8 MB)
February 2007 Tze-Chaing Chen -- IBM Fellow; V.P., Science & Technology, Research Division
 
Member Only Content European Competitiveness in Action (1.2MB PDF)
February 2007 Jean-Philippe Dauvin--ST Microelectronics
 
Member Only Content Creating the Next Experience: Adding Value in the Industry (692KB PDF)
February 2007 Franz van Houten -- President and CEO, NXP Semiconductors
 

 
Best of SMC
 
Member Only Content Business Perspective on the Growing Adoption of Advanced Materials (349KB PDF)
January 2008
Avinash Kant, Ph.D., Principal, Equity Research, Broadpoint Capital
 
Member Only Content Critical Materials: Market Trends for Wafer Fab Materials (787KB PDF)
January 2008
John Housley, Techcet Group, LLC.
 
Member Only Content Emerging Materials for Front End IC Process (1.5MB PDF)
January 2008
Mark Thirsk, Linx Consulting
 
Member Only Content Leveraging Cooperative Process Technology 32nm (812KB PDF)
January 2008
Tom Thorpe Vice President, External Development & Manufacturing
 
Member Only Content Materials Challenges in Lithography Beyond 32nm (2.5MB PDF)
January 2008
Bryan J. Rice, SEMATECH
 
Member Only Content New Materials are Required by Device and Packaging Roadmaps (3.8MB PDF)
January 2008
W. Bottoms, NanoNexus
 
Member Only Content Optimizing Silicon Technology Through Innovation & Collaboration (2.7MB PDF)
January 2008
Paul Farrar Vice President IBM Semiconductor Research & Development Center, East Fishkill, New York
 
Member Only Content Packaging Materials Forecast (273KB PDF)
January 2008
Daniel Tracy, Senior Director, Industry Research and Statistics, SEMI
 
Member Only Content SC Material Growth: Prospects & Challenges (369KB PDF)
January 2008
Jean-Marc GIRARD, PhD, Technology Director, Air Liquide Electronics
 
Member Only Content Solar Market Growth and Direct Materials Suppliers (1.8MB PDF)
January 2008
J. Craig Hunter, General Manager, Thin Film Products Solar Business Group, Applied Materials, Inc.
 
Member Only Content Technology Landscape Changes Ahead (5.7MB PDF)
January 2008
John Hunt, William Chen, ASE Group
 
Member Only Content Technology Trends in Large Area Electronics (3MB PDF)
January 2008
Bock Fraunhofer, IZM Institut Zuverlässigkeit und Mikrointegration
 
Member Only Content The Revolution in Lighting: High Power LED Technology (1.65MB PDF)
January 2008
M. George Craford, CTO, Philips Lumileds Lighting Company
 
Member Only Content TR&D Consortia: Their Critical Role in Future Advancements (5.6MB PDF)
January 2008
Gilbert Declerck, President and CEO IMEC
 
Member Only Content When Back-End Meets Front-End (2.73MB PDF)
January 2008
E. Jan Vardaman, President, TechSearch International, Inc.
 

 

Email this Page | Print this Page | Privacy Policy | Terms of Use | Site Map

Copyright © 2008 Semiconductor Equipment and Materials International (SEMI®).
All rights reserved.