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Resources for Members: Event Highlights

Welcome to a premium content section which provides additional valuable resources for SEMI Members. The information on this page is from past events and presentations. This Members Only area includes information on Semiconductor Equipment, Materials, Public Policy, Nanotechnology and MEMS. Also included are selected presentations from SEMI executive level conferences (ISS, SMC, and SBC).

 
  

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BEST OF ASMC
 
Member Only Content A 300mm Semiconductor Manufacturing Foreign Material Reduction Initiative
Christopher W. Long, Thomas Sienkiewcz; IBM Systems and Technology Group
 
Member Only Content A Methodology for Measuring, Reporting, Navigating, and Analyzing OEP
Gokul R Chakravarthy, Paul N Keller, Benjamin R Wheeler, Susan Van Oss
Industrial Engineering Department, 300MM Fab, IBM
 
Member Only Content Immersion Lithography Ready for 45 nm Manufacturing and Beyond
Soichi Owa*, Katsushi Nakano, Hiroyuki Nagasaka, Tomoharu Fujiwara, Tomoyuki Matsuyama, Yasuhiro Ohmura and Holly Magoona; Nikon
 
Member Only Content Integrated Targeting, Near Real-Time Scheduling, and Dispatching
Integrated Targeting, Near Real-Time Scheduling, and Dispatching with Automated Execution in Semiconductor Manufacturing
Nirmal Govind, Eric W. Bullock, Linling He, Bala Iyer, Murali Krishna, and Charles S. Lockwood
Intel Corporation
 
Member Only Content Limitations of Analysis of Metal Impurities Analysis in High-k Film
Ya-Ling Po, Carol Lin, Shian-Shio Chen, Tings Wang
 
Member Only Content Novel Thermally-Stable Hafnium and Zirconium ALD Precursors
Audrey Pinchart, Nicolas Blasco, Christophe Lachaud, Anthony Schleisman, Air Liquide Research & Development; Christian Dussarrat, Ikuo Suzuki, K. Yanagita; Air Liquide Laboratories
 
Member Only Content Reducing Time-to-Respond in a Modern Manufacturing Environment
Raymond Van Roijen, IBM
 
Member Only Content Scheduling for Backend Manufacturing with SPTB Heuristic
Smallest Bit-Line Contact of 76nm pitch on NAND Flash Cell by using Reversal PR (Photo Resist) and SADP (Self-Align Double Patterning) Process
Byungjoon Hwang, Jaehwang Shim, Jang-Ho Park, Kwangseok Lee, Sunghyun Kwon, Sang-Yong Park, Yoonmoon Park, Dong-Hwa Kwak, Jaekwan Park and Won-Seong Lee; Samsung Electronics Co., Ltd.
 
Member Only Content SelOx Deposition as Unique Gap-Fill Solution for Shallow Trench Isolation
H. M. Lindemann, J. Radecker, H.-P. Sperlich
Qimonda Dresden GmbH & Co. OHG
 
Member Only Content Smallest Bit-Line Contact of 76nm pitch on NAND Flash Cell
Smallest Bit-Line Contact of 76nm pitch on NAND Flash Cell by using Reversal PR (Photo Resist) and SADP (Self-Align Double Patterning) Process
Byungjoon Hwang, Jaehwang Shim, Jang-Ho Park, Kwangseok Lee, Sunghyun Kwon, Sang-Yong Park, Yoonmoon Park, Dong-Hwa Kwak, Jaekwan Park and Won-Seong Lee; Samsung Electronics Co., Ltd.
 
Member Only Content Test Structure and e-Beam Inspection Methodology for In-line Detection
Test Structure and e-Beam Inspection Methodology for In-line Detection of (Non-visual) Missing Spacer Defects
Oliver D. Patterson, IBM; Kevin Wu, KLA-Tencor; Dan Mocuta, IBM; Kourosh Nafisi, IBM
 
Member Only Content Yield Learning Methodology in Early Technology Development
Xu Ouyang, David Riggs, Ishtiaq Ahsan, Oliver D. Patterson, Dallas M. Lea, Benjamin Ebersman, IBM; Katherine V. Hawkins, IBM; Keith Miller, KLA-Tencor; Stephen Fox, IBM; James Rice, IBM
 

 
Other Highlights
 
Member Only Content High Volume Solar Cell Production Lines Concepts and Cost Aspects (PDF)
Dr. Josef J. Haase - Centrotherm
 
Member Only Content Semiconductor Equipment and Materials Outlook (550KB PDF)
January 2007 at SEMICON Korea 2007 Dan Tracy, Senior Director, Industry Research and Statistics, SEMI
 

 
Strategic Business Conference
 
Member Only Content Presentation from Nanochip
(11.4MB SWF) April 2008
Gordon Knight, CEO Nanochip Inc.
 
Member Only Content A Collaboration Model to Enable the Age of Material Innovation in Semiconductors
(60MB WMV) April 2008
Paul A. Farrar, JR; Vice President, Process Development, IBM Semiconductor Research and Development Center
 
Member Only Content Chip and Package Integration: New Opportunities for Eqpmt and Mtrls Suppliers
(278KB PDF) May 2007, David Hays -- VP Wafer Level Packaging, Amkor Technology
 

 

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